Product Lines

2929 Bondply Series

Rogers 2929 bondply is an unreinforced, thermoset based thin film adhesive system.

92ML™ Materials

92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.

AD Series® Laminates

Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.

CLTE Series® Laminates


Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability。


四季彩票登陆 COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards。

CuClad® Series

四季彩票登陆 Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.

DiClad® Series Laminates

Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications。

IM Series™ Laminates

Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades。

IsoClad® Series Laminates

IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.

Kappa® 438 Laminates

Kappa® 438 thermoset laminates are glass reinforced hydrocarbon materials, developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates。

MAGTREX™ Laminates

MAGTREX™ 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity。

Prepregs and Bondplys

Rogers offers a wide arrangement of bonding and adhesion materials directly matched to complement our broad, industry-leading, high frequency circuit material offerings.

RO3000® Series


RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.

RO4000® Series

RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.

RT/duroid® Laminates

四季彩票登陆 RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications。

TC Series® Laminates

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

TMM® Laminates

四季彩票登陆 Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.

XtremeSpeed™ RO1200™ Series 

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.

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ROG Blog

The Rog Blog is contributed by John Coonrod and various other experts from Rogers Corporation, providing technical advice and information about RF/microwave materials.

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